Structural and thermal Design of small size devices.
Experience with plastic injections, molds and parts design.
Experience with thermal and structure simulations.
Experience with PCB manufacturing and assembly processes.
Experience with Electronic industry standards.
Experience with SolidWorks and thermal simulation tools.
At 2-3 years of experience as Electronic Packaging engineer
Other Comments: Smart, responsible, able to work in a team, cares about the quality of his work.
Education: At least B.Sc. in Mechanical Engineering.