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Funding10M-20M USD
EmployeesShhhh...
SalaryShhhh...
FulltimeYes
TelecommuteNo
IndustryMobile, Hardware, Communications, Infrastructure
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Other Openings
Engineering
Engineering
Engineering

Mechanical Engineer

at Modu in Israel   —   Apr 17, 2014   |  
Overview
Structural and thermal Design of small size devices.
Experience
Experience with plastic injections, molds and parts design.
Experience with thermal and structure simulations.
Experience with PCB manufacturing and assembly processes.
Experience with Electronic industry standards.
Experience with SolidWorks and thermal simulation tools.
At 2-3 years of experience as Electronic Packaging engineer
Other Comments: Smart, responsible, able to work in a team, cares about the quality of his work.
Education
Education: At least B.Sc. in Mechanical Engineering.
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